production process TQHIP power mesfet foundry service features ? power mesfet process ? interconnects: ? 2 global (one airbridge) ? 1 local ? high-q passives ? bulk & thin film resistors ? backside vias optional ? high volume production processes ? validated models and design support applications ? power amplifiers ? switches ? frequencies thru x-band ? base station driver amplifiers ? catv line amplifiers ? cellular power amps, driv- ers, switches general description triquint?s TQHIP process is our robust, high power density mesfet process. it provides a straight-forward, low cost process for a variety of circuits and applications. its high oper- ating and breakdown voltages make it ideal for wireless or wired infrastructure applications. a thick (4 m) gold airbridge complements the 2 m thick gold global metal and 0.5 m thick gold surface layer for wiring flexibility and interconnect density. precision nicr resistors and high value mim capaci- tors are included. semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 1 of 4; rev 2.1 4/30/02 isolation implant nicr n-/p- channel n+ n+ metal 0 metal 1 ? 2 um metal 1 air bridge - 4um mim metal d mesfet nicr resistor mim capacitor semi-insulating gaas substrate isolation implant nicr n-/p- channel n+ n+ metal 0 metal 1 ? 2 um metal 1 air bridge - 4um isolation implant nicr n-/p- channel n+ n+ metal 0 metal 1 ? 2 um metal 1 isolation implant nicr nicr n-/p- channel n+ n+ n-/p- channel n+ n+ metal 0 metal 1 ? 2 um metal 1 metal 1 ? 2 um metal 1 metal 1 ? 2 um metal 1 air bridge - 4um mim metal d mesfet nicr resistor mim capacitor semi-insulating gaas substrate TQHIP process cross-section
production process TQHIP power mesfet foundry service semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 2 of 4; rev 2.1 4/30/02 TQHIP process details element parameter value units d-fet vp -2.3 v gate length 0.5 um idss 245 ma/mm imax 370 ma/mm ft @ 50% idss 16.5 ghz fmax 60 ghz gm 140 ms/mm bvgso, typical 9 v bvgdo, typical 14 v interconnect metal layers 3 mim caps values 600 pf/mm2 resistors nicr 50 ohms/sq bulk 800 ohms/sq inductors q 25 @ 2 ghz vias yes mask layers no vias 14 with vias 16 bvds, typical 18 v operating temperature range -65 to +150 oc capacitor breakdown voltage?typ. 40 v 25 v min. TQHIP process details maximum ratings
production process TQHIP power mesfet foundry service semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 3 of 4; rev 2.1 4/30/02 measured i-v characteristic curve 300 um device; t=27degc 0.000 20.000 40.000 60.000 80.000 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 vd (v) id (ma) h1ss_dc 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 vds (volts) vgs=-2.0 vgs=-1.5 vgs=-1.0 vgs=-0.5 v g s=0.0 measured vs. modeled dc characteristics; h1ss - d1010 fet (lg = 1.0 m m, lgs = lgd = 1.0 m m) model parameters; @ t=27c.
production process TQHIP power mesfet foundry service semiconductors for communications www.triquint.com triquint semiconductor 2300 ne brookwood pkwy hillsboro, oregon 97124 phone: 503-615-9000 fax: 503-615-8905 email: info@triquint.com page 4 of 4; rev 2.1 4/30/02 applications support services ? tiling of gdsii stream files including pcm ? design rule check services ? layout versus schematic check services ? packaging development engineering ? test development engineering: ? on-wafer ? packaged parts ? thermal analysis engineering ? yield enhancement engineering ? part qualification services ? failure analysis manufacturing services ? mask making ? production 150 wafer fab ? wafer thinning ? wafer sawing ? substrate vias ? dc die sort testing ? rf on-wafer testing ? plastic packaging ? rf packaged part testing please contact your local triquint semiconductor representative/ distributor or foundry services division marketing for additional information: e-mail: sales@triquint.com; phone: (503) 615-9000 fax: (503) 615-8905 design tools available ? device library of circuit elements: fet, diodes, thin film and implanted resistors, capacitors, inductors ? parameters for ?triquint?s own model? (tom) in popular simulators ? agilent ads design kit available now ? pspice models available now ? layout and verification kit for iceditors now ? qualified package models for supported package styles prototyping and development ? prototype wafer option (pwo): ? customer-specific masks, customer schedule ? 2 wafers delivered ? hot lot cycle time ? with thinning and sawing; optional backside vias ? design sensitivity test run (dst): ? yield analysis ? design sensitivity to process variation ? 14 wafer start; spread of vp and cgs values process qualification status ? TQHIP is a fully released and qualified process ? reliability reports ? TQHIP process qualification ? high power product qualification ? TQHIP element qualification report ? for more information on quality and reliability, contact triquint or visit: www.triquint.com/ manufacturing/qr/bdy_qr-pubs.htm training ? gaas design classes: ? half day introduction; upon request ? four day technical training; fall & spring at triquint oregon facility ? for training and schedules please visit:: www.triquint.com/foundry
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